G.SKill recently released a new Trident Z variant that is optimized for the new AMD Ryzen 3000 CPUs and X570 motherboards – the G.Skill Trident Z Neo DDR4 memory modules. The Trident Z Neo DDR4 memory series is said to feature Samsung’s B-die memory chip with “extremely low” latency. The DDR4-3800MHz memory kit has a latency of CL14 and it’s available in 16GB (2x8GB) and 32GB (4x8GB) capacities. G.Skill also presented some benchmarks showing the performance of the Trident Z Neo DDR4 memory on an X570 motherboard powered by an AMD Ryzen 9 3900X processor. You can check out more details and the results from the official news below.
G.Skill Trident Z Neo DDR4-3800MHz CL14 Memory Kit
It’s well-known that memory performance with the new AMD Ryzen 3000 processor series is best when Infinity Fabric being tied to the memory clock at a 1:1 ratio. The G.SKILL R&D team is dedicated to push the performance boundaries even further and developed a high-frequency, low-latency memory kit at DDR4-3800 CL14-16-16-36 in capacity configurations of 8GBx2 and 8GBx4, reaching a superb memory bandwidth performance under the optimal 1:1 ratio.
As seen in the screenshot below, this Trident Z Neo memory kit is running at DDR4-3800 CL14-16-16-36 in 8GBx2 capacity with the AMD Ryzen 9 3900X processor and the MSI MEG X570 GODLIKE motherboard, reaching a tested memory bandwidth of 58GB/s, 56GB/s, and 58GB/s for read, write, and copy, respectively.
Like any G.SKILL memory kit, the specifications must remain fully stable under a memory stress test, as shown in the screenshots below, showing the 32GB (8GBx4) memory kit operating on an ASUS ROG CROSSHAIR VIII Formula motherboard with the AMD Ryzen 5 3600X processor and the 16GB (8GBx2) memory kit running on the MSI MEG X570 GODLIKE motherboard with the AMD Ryzen 9 3900X processor.
G.Skill Trident Z Neo DDR4-3800 CL14-16-16-36 32GB (8GBx4)